Beam Profiler Finder
High Power Beam Profilers Comparison Table
| BeamOn U3 HP | Beam Analyzer HP | BeamOn X HP | LAM Beam Analyzer | LAM U3 | |
|---|---|---|---|---|---|
| Laser Type | CW & Pulsed | CW | CW & Pulsed | CW | CW & Pulsed |
| Beam width resolution | 1 micron or better | For beams > 100 μm in size: 1 μm. For beams <100 μm in size: 0.1 μm | 1 micron or better | For beams > 100 μm in size: 1 μm. For beams <100 μm in size: 0.1 μm | 1 micron or better |
| Beam Size | ⌀75 μm – ⌀6 mm | ⌀15 μm – ⌀9 mm | ⌀60 μm – ⌀5 mm | 35 μm – ⌀8 mm | ⌀75 μm – ⌀6 mm |
| Spectral Response | 350 – 1310 nm | 350 – 1100 nm (InGaAs version available) |
350 – 1310 nm | Si: 350 – 1100 nm. Contact factory for other wavelengths | 350 – 1310 nm |
| Resolution (H x V pixels) | 1920 x 1200 | Adaptive according to beam size | 1280 x 1024 – Global Shutter | Adaptive according to beam size | 1920 x 1200 |
| Sensor Active Area (mm) | 11.34 x 7.13 | 9 x 9 | 6.78 x 5.4 | 9 x 9 | 11.34 x 7.13 |
| Number of Blades | ~~~~~~~~~ | 7 blades with image tomographic reconstruction | ~~~~~~~~~ | 7 blades with image tomographic reconstruction | ~~~~~~~~~ |
| Gain Control | x24 | Automatic | x4 | Automatic | x24 |
| Dynamic Range | 60 dB , 12 bit | ~~~~~~~~~ | 70 dB, 10 bit | ~~~~~~~~~ | 60 dB , 12 bit |
| Exposure Speed | 39 µsec to 20 sec | ~~~~~~~~~ | 9 μsec to 1 sec | ~~~~~~~~ | 39 µsec to 20 sec |
| Frame Rate | 40 fps (8 bit) | 5 fps | Over 50 fps | 5 fps | 40 fps (8 bit) |
| Working Distance | 49 mm (contact factory) | Optical distance from input surface to sensor is 40.7 ± 0.2 mm | 49 mm (contact factory) | 49 mm (contact factory) | Optical distance from input surface to sensor is 40.7 ± 0.2 mm |
| Maximum BPP | Max. input angle – 25 deg. | Max. input angle – 25 deg. | Max. input angle – 25 deg. | Max. input angle – 25 deg. | Max. input angle – 25 deg. |
| Maximum power density | 1,000,000 W/cm² (contact factory) | 1,000,000 W/cm² (contact factory) | 1,000,000 W/cm² (contact factory) | 1,000,000 W/cm² (contact factory) | 1,000,000 W/cm² (contact factory) |
| Power measuring | With user’s pre-calibration at a selected point | With user’s pre-calibration at a selected point | With user’s pre-calibration at a selected point | With user’s pre-calibration at a selected point | With user’s pre-calibration at a selected point |
| Power range @900/1070 nm | CW 1-2500 W, Pulsed 1 – 1000 W | Up to 4 kW (with filters & pressurized air-cooling, some restrictions may apply) | CW 1-2500 W, Pulsed 1 – 1000 W | Up to 4 kW (with filters & pressurized air-cooling, some restrictions may apply) | CW 1-2500 W, Pulsed 1 – 1000 W |
| Output power from back side of beam sampler | 90% of input power. The Beam Sampler directs only a small portion of laser power for detector measurements. Most of the power exits according to drawing. | 90% of input power. The Beam Sampler directs only a small portion of laser power for detector measurements. Most of the power exits according to drawing. | 90% of input power. The Beam Sampler directs only a small portion of laser power for detector measurements. Most of the power exits according to drawing. | With beam dump – no significant output power | With beam dump – no significant output power |
| Cooling conditions | Filtered pressurized air of 6-8 Bar | Filtered pressurized air of 6-8 Bar | Filtered pressurized air of 6-8 Bar | Filtered pressurized air of 6-8 Bar | Filtered pressurized air of 6-8 Bar |
| Sensor type | CMOS – 1/1.2” format | Silicone (Si) – Knife-edge technology | CMOS – 1/1.8″ format | Silicone (Si) – Knife-edge technology | CMOS – 1/1.2” format |
| Beam width accuracy | ±1.5% | ±1.5% | ±1.5% | ±1.5% | ±1.5% |
| Power accuracy | ±5% | ±5% | ±5% | ±5% | ±5% |
| Position resolution | 1 μm | 1 μm | 1 μm | 1 μm | 1 μm |
| Pixel Size | 5.86 µm x 5.86 µm | Adaptive according to beam size | 5.3 μm x 5.3 μm | Adaptive according to beam size | 5.86 µm x 5.86 µm |
| Pixel Bit Depth | 8/12 bits | 12 bits | 8/10 bits | 12 bits | 8/12 bits |
| Background Subtraction | User activated | Automatic | User activated | Automatic | User activated |
| Trigger | •Internal Software •Hardware Falling or Rising Edge •Trigger Delay 0.015ms – 4.0 sec |
~~~~~~~~~ | •Internal Software •Hardware Falling or Rising Edge •Trigger Delay 0.015ms – 4.0 sec |
~~~~~~~~~ | •Internal Software •Hardware Falling or Rising Edge •Trigger Delay 0.015ms – 4.0 sec |
| Accessories | ~~~~~~~~~ | ~~~~~~~~~ | ~~~~~~~~~ | ~~~~~~~~~ | ~~~~~~~~~ |
| Power Requirements | ~2 Watt (Via USB 3.0 interface) | ~2.5 Watt (Via USB 2.0 interface) | ~1.5 Watt (Via USB 3.0 interface) | ~2.5 Watt (Via USB 2.0 interface) | ~2 Watt (Via USB 3.0 interface) |
| Dimensions (L x W x H) in mm | 64 x 103 x 73.5 | ~~~~~~~~~ | ⌀64 mm x 102 mm deep | ~~~~~~~~~ | 147 x 105 x 48 |
| Weight (typical) | 350 gr. | 800 gr | 350 gr with cable | Sensor head with cable ~ 1500 gr. | Sensor head with cable ~ 1500 gr. |
| Min. Hardware Requirements | CPU i3 1.6 GHz, 4 GB RAM | CPU i3 1.6 GHz, 4 GB RAM | CPU i3 1.6 GHz, 4 GB RAM | CPU i3 1.6 GHz, 4 GB RAM | CPU i3 1.6 GHz, 4 GB RAM |
| Interface | USB 3.0, Windows 7/8/10 (32 & 64 bit) | USB 2.0, Windows 7/8/10 (32 & 64 bit) | USB 3.0, Windows 7/8/10 (32 & 64 bit) | USB 2.0, Windows 7/8/10 (32 & 64 bit) | USB 3.0, Windows 7/8/10 (32 & 64 bit) |
| Mechanical Interface | Post mounting: 2 concentric opposite 8-32 UNC, 6 mm depth | ~~~~~~~~~ | Post mounting: 8-32 UNC, 6 mm depth | ~~~~~~~~~ | Post mounting: 2 concentric opposite M4, 6 mm depth |
| Operating Temperature | 0° – 35° C | 0° – 35° C | 0° – 35° C | 0° – 35° C | 0° – 35° C |